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1

Macro- and Micro-Deformation Behavior of Sintered-Copper Die-Attach Material

Suzuki, Tomohisa, Yasuda, Yusuke, Terasaki, Takeshi, Morita, Toshiaki, Kawana, Yuki, Ishikawa, Dai, Nishimura, Masato, Nakako, Hideo, Kurafuchi, Kazuhiko

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2018

Language:

english

File:

PDF, 2.30 MB

english, 2018

2

Effect of Manufacturing Process on Micro-Deformation Behavior of Sintered-Silver Die-Attach Material

Suzuki, Tomohisa, Terasaki, Takeshi, Kawana, Yuki, Ishikawa, Dai, Nishimura, Masato, Nakako, Hideo, Kurafuchi, Kazuhiko

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2016

Language:

english

File:

PDF, 2.08 MB

english, 2016

3

Tensile-Fatigue Behavior of Sintered Copper Die-Attach Material

Suzuki, Tomohisa, Yasuda, Yusuke, Terasaki, Takeshi, Morita, Toshiaki, Kawana, Yuki, Ishikawa, Dai, Nishimura, Masato, Nakako, Hideo, Kurafuchi, Kazuhiko, Matsuda, Tetsuya

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2019

Language:

english

File:

PDF, 2.46 MB

english, 2019

4

[IEEE 2019 International Conference on Electronics Packaging (ICEP) - Niigata, Japan (2019.4.17-2019.4.20)] 2019 International Conference on Electronics Packaging (ICEP) - Analysis of Bonding Interfaces of Pressureless-sintered Cu on Metallization Layers

Ishikawa, Dai, An, Bao Ngoc, Mail, Matthias, Wurst, Helge, Leyrer, Benjamin, Blank, Thomas, Weber, Marc, Ueda, Suguru, Nakako, Hideo, Kawana, Yuki

Year:

2019

Language:

english

File:

PDF, 2.66 MB

english, 2019

5

Amelioration of acute graft-versus-host disease by NKG2A engagement on donor T cells

Hiroki Kawamura, Hideo Yagita, Tetsuro Nisizawa, Nakako Izumi, Chikako Miyaji, Russell E. Vance, David H. Raulet, Ko Okumura, Toru Abo

Journal:

European Journal of Immunology

Year:

2005

Language:

english

File:

PDF, 483 KB

english, 2005

6

Novel materials for electronic device fabrication using ink-jet printing technology

Yasushi Kumashiro, Hideo Nakako, Maki Inada, Kazunori Yamamoto, Akira Izumi, Masamichi Ishihara

Journal:

Applied Surface Science

Year:

2009

Language:

english

File:

PDF, 274 KB

english, 2009

7

Design and synthesis of semiflexible substituted polyacetylenes with helical conformation

Ryoji Nomura, Hideo Nakako, Toshio Masuda

Journal:

Journal of Molecular Catalysis A: Chemical

Year:

2002

Language:

english

File:

PDF, 222 KB

english, 2002

8

Polymerization of N-substituted 2-propynamides with transition metal catalysts

Hideo Nakako, Ryoji Nomura, Toshio Masuda

Journal:

Polymer Bulletin

Year:

2001

Language:

english

File:

PDF, 123 KB

english, 2001

9

Helix Inversion of Poly(propiolic esters)

Nakako, Hideo, Nomura, Ryoji, Masuda, Toshio

Journal:

Year:

2001

Language:

english

File:

PDF, 100 KB

english, 2001

10

Effect of Chiral Substituents on the Helical Conformation of Poly(propiolic esters)

Nakako, Hideo, Mayahara, Yasushi, Nomura, Ryoji, Tabata, Masayoshi, Masuda, Toshio

Journal:

Year:

2000

Language:

english

File:

PDF, 100 KB

english, 2000

11

Synthesis and Structure in Solution of Poly[(−)-menthyl propiolate] as a New Class of Helical Polyacetylene

Nakako, Hideo, Nomura, Ryoji, Tabata, Masayoshi, Masuda, Toshio

Journal:

Year:

1999

Language:

english

File:

PDF, 65 KB

english, 1999

12

Conformational Study of Helical Poly(propiolic esters) in Solution

Nomura, Ryoji, Fukushima, Yasunori, Nakako, Hideo, Masuda, Toshio

Journal:

Journal of the American Chemical Society

Year:

2000

Language:

english

File:

PDF, 96 KB

english, 2000

13

[IEEE 2016 International Conference on Electronics Packaging (ICEP) - Hokkaido, Japan (2016.4.20-2016.4.22)] 2016 International Conference on Electronics Packaging (ICEP) - Thermal cycling lifetime estimation of sintered metal die attachment

Suzuki, Tomohisa, Yasuda, Yusuke, Terasaki, Takeshi, Morita, Toshiaki, Kawana, Yuki, Ishikawa, Dai, Nishimura, Masato, Nakako, Hideo, Kurafuchi, Kazuhiko

Year:

2016

Language:

english

File:

PDF, 1.10 MB

english, 2016

14

Control of Threshold Voltage of O-FET by Modifying of Side Chain Groups on Polymer Gate Dielectrics

Nakako, Hideo, Kumashiro, Yasushi, Yamamoto, Kazunori

Journal:

Journal of Photopolymer Science and Technology

Year:

2010

Language:

english

File:

PDF, 436 KB

english, 2010

15

Novel Group 6 Transition Metal Catalysts, MCl2(CO)3(AsPh3)2 (M=W, Mo), for the Metathesis Polymerization of Substituted Acetylenes

Nakako, Hideo, Misumi, Yoshihiko, Masuda, Toshio, Bencze, Lajos, Szalai, Gabor

Journal:

Polymer Journal

Year:

1998

File:

PDF, 649 KB

1998

16

N-Substituted-2-propynamides. Highly Reactive Acetylene Derivatives toward Hydrogen Migration Polymerization

Nomura, Ryoji, Nakako, Hideo, Masuda, Toshio

Journal:

Polymer Journal

Year:

2000

File:

PDF, 226 KB

2000

17

Metathesis Polymerization of Substituted Acetylenes and Norbornene by M(CO)6-Ph2CCl2-hν (M=Mo, W) Catalysts

Misumi, Yoshihiko, Tamura, Kozo, Nakako, Hideo, Masuda, Toshio

Journal:

Polymer Journal

Year:

1998

File:

PDF, 582 KB

1998

18

Effect of Loading Type on Fatigue Lifetime of Sintered-silver Die Attach

Suzuki, Tomohisa, Terasaki, Takeshi, Yasuda, Yusuke, Morita, Toshiaki, Kawana, Yuki, Ishikawa, Dai, Nishimura, Masato, Nakako, Hideo, Kurafuchi, Kazuhiko

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2018

Language:

english

File:

PDF, 937 KB

english, 2018

19

Development of Copper Materials and Processing for Printed Electronics

Kuroda, Kyoko, Nakako, Hideo, Inada, Maki, Noudou, Takaaki, Kumashiro, Yasushi

Journal:

Transactions of The Japan Institute of Electronics Packaging

Year:

2012

Language:

english

File:

PDF, 1.14 MB

english, 2012

20

[IEEE 2018 7th Electronic System-Integration Technology Conference (ESTC) - Dresden, Germany (2018.9.18-2018.9.21)] 2018 7th Electronic System-Integration Technology Conference (ESTC) - Copper Die-Bonding Sinter Paste: Sintering and Bonding Properties

Ishikawa, Dai, Nakako, Hideo, Kawana, Yuki, Sugama, Chie, Negishi, Motohiro, Ejiri, Yoshinori, Ueda, Suguru, An, Bao Ngoc, Wurst, Helge, Leyrer, Benjamin, Blank, Thomas, Weber, Marc

Year:

2018

Language:

english

File:

PDF, 741 KB

english, 2018

21

[IEEE 2018 20th International Conference on Electronic Materials and Packaging (EMAP) - Clear Water Bay, Hong Kong (2018.12.17-2018.12.20)] 2018 20th International Conference on Electronic Materials and Packaging (EMAP) - Evaluation of Microscopic Strain Distribution of Low-Temperature Sintering Die Attach in Thermal Cycling Test

Suzuki, Tomohisa, Yasuda, Yusuke, Terasaki, Takeshi, Morita, Toshiaki, Kawana, Yuki, Ishikawa, Dai, Nishimura, Masato, Nakako, Hideo, Kurafuchi, Kazuhiko, Matsuda, Tetsuya

Year:

2018

Language:

english

File:

PDF, 300 KB

english, 2018

22

Bonding Abilities of Pressure-assisted Sintered Copper for Die-Bonding of Large Chips

Ishikawa, Dai, An, Bao Ngoc, Mail, Matthias, Wurst, Helge, Leyrer, Benjamin, Blank, Thomas, Weber, Marc, Nakako, Hideo

Journal:

Transactions of The Japan Institute of Electronics Packaging

Year:

2020

File:

PDF, 538 KB

2020